TSV technology (through-silicon through-hole technology), generally referred to as through-silicon through-hole technology, is a new technical solution for interconnecting stacked chips in three-dimensional integrated circuits. TSV can make the density of the chips stacked in the three-dimensional direction the largest, the shortest interconnection between the chips, the smallest size, and greatly improve the performance of chip speed and low power consumption. Beike Nano masters the latest TSV technology, which can help customers to complete TSV personalized requirements.
As one of the most promising technologies in microelectronics manufacturing, TSV technology has been widely used in MEMS devices, memory, image sensors, power amplifiers, biological application equipment and various mobile phone chips.
Through hole diameter: 20-30um Aspect ratio: 10: 1 Through-hole materials: copper, gold Through hole status: solid hole, hollow hole
Graphics can be customized High through hole yield Can be mass produced Process technology is mature
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